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Cycles - Specification for stem wedge angle Ingestion-build-205840 Old references to ISO/R 230:1961

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Old references to ISO/R 230:1961 have been changed to ISO 230-1:2012 and all observations have been updated accordingly

This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method

planar polymer waveguide

This part of ISO/IEC 7811 specifies requirements for a 51

Designation of the direct tension indicator

Cycles - Specification for stem wedge angle Ingestion-build-205840 Old references to ISO/R 230:1961

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