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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards) PAS 015 the modelling approach
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards) PAS 015 the modelling approach
$174.00
Description
the modelling approach
IEC 60634:1993
BS 6701 provides requirements for installing telecommunications equipment
Information to be supplied by the manufacturer
which had previously been flagged up for a new standard
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards) PAS 015 the modelling approach
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