E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology · ボックスまたはカセットと装置ロードポートまたは搬送装置との間

·        ボックスまたはカセットと装置ロードポートまたは搬送装置との間

Gauges that differ in at least one system or subsystem may be considered different for the purpose of comparison

Two test methods are covered as follows:

1 — Specification for SOAP Binding of Data Collection Management (DCM)

which define the properties of the substrate and the epitaxial layer

E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology · ボックスまたはカセットと装置ロードポートまたは搬送装置との間1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the Tape Frame FOUP which is intended to be used to transport and store 300 mm tape frames, as specified by SEMI G74 and SEMI G87, within IC manufacturing facilities. 2 Scope 2. 1 This Standard specifies the external features and dimensions of the Tape Frame FOUP. 2. 2 This Standard specifies the internal dimensions for storing the tape frames in the Tape