G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded in order to control particulate

in order to control particulate contamination from those gases

EQIPs may be defined for a new equipment type not previously addressed in this Standard

orgで入手可能となる。初版は1999年発行。前版は2005年3月発行。

This Test Method is also applicable to other types of packages

SEMI E99-1104E (editorial revision)

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded in order to control particulateThis Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and