M01600 - SEMI M16 - Specification for Polycrystalline Silicon StdPbc-0714 SEMI T7 — Specification for

SEMI T7 — Specification for Back Surface Marking of Double-sided Polished Wafers with a Two-Dimensional Matrix Code Symbol

whereby the sample is placed into a platinum or quartz crucible and thermally decomposed

The values given in parentheses are for information only

As low stiffness can occur with any material

SEMI E133-0212 (technical revision)

M01600 - SEMI M16 - Specification for Polycrystalline Silicon StdPbc-0714 SEMI T7 — Specification forThis Specification is intended for use in procurement of polycrystalline silicon for growth of electronic grade monocrystalline silicon ingots. Such ingots are sliced into wafers that are subsequently used for the production of semiconductor devices, integrated circuits, and other microelectronic components including microelectromechanical systems (MEMS). This Specification covers requirements for polycrystalline silicon (poly) used to produce single